Thirty-second IEEE International Electronics Manufacturing Technology Symposium and Twelfth IEEE International Symposium on Advanced Packaging Materials : processes, properties, and interfaces : October 3-5, 2007, Holiday Inn San Jose, San Jose/Silicon Valley, CA, USA / organized and sponsored by the IEEE Components, Packaging and Manufacturing Technology Society, and the Santa Clara Valley Chapter of the CPMT Society.

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Bibliographic Details
Corporate Authors: IEEE International Electronics Manufacturing Technology Symposium San Jose, Calif., Institute of Electrical and Electronics Engineers, Components, Packaging & Manufacturing Technology Society, Components, Packaging & Manufacturing Technology Society. Santa Clara Valley Chapter, IEEE Xplore (Online service), IEEE International Symposium on Advanced Packaging Materials
Format: eBook
Language:English
Published: Piscataway, NJ : Institute of Electrical and Electronics Engineers, c2007.
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Online Access:Access restricted to subscribers
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