Proceedings of technical papers 2007 International Microsystems, Packaging, Assembly, and Circuits Technology Conference : October 1-3, 2007, Taipei International Convention Center, Taipei, Taiwan.
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| Corporate Authors: | , , |
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| Format: | eBook |
| Language: | English |
| Published: |
Chutung, Hsinchu, Taiwan : Piscataway, NJ :
Industrial Technology Research Institute ; IEEE,
c2007.
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| Subjects: | |
| Online Access: | http://ieeexplore.ieee.org/servlet/opac?punumber=4433550 |
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