International Microsystems, Packaging, Assembly, and Circuits Technology Conference Taipei, Taiwan, Gong ye ji shu yan jiu yuan, & Institute of Electrical and Electronics Engineers. (2007). Proceedings of technical papers 2007 International Microsystems, Packaging, Assembly, and Circuits Technology Conference : October 1-3, 2007, Taipei International Convention Center, Taipei, Taiwan: 2007 International Microsystems, Packaging, Assembly, and Circuits Technology Conference : October 1-3, 2007, Taipei International Convention Center, Taipei, Taiwan. Industrial Technology Research Institute ; IEEE.
Chicago Style (17th ed.) CitationInternational Microsystems, Packaging, Assembly, and Circuits Technology Conference Taipei, Taiwan, Gong ye ji shu yan jiu yuan, and Institute of Electrical and Electronics Engineers. Proceedings of Technical Papers 2007 International Microsystems, Packaging, Assembly, and Circuits Technology Conference : October 1-3, 2007, Taipei International Convention Center, Taipei, Taiwan: 2007 International Microsystems, Packaging, Assembly, and Circuits Technology Conference : October 1-3, 2007, Taipei International Convention Center, Taipei, Taiwan. Chutung, Hsinchu, Taiwan : Piscataway, NJ: Industrial Technology Research Institute ; IEEE, 2007.
MLA (9th ed.) CitationInternational Microsystems, Packaging, Assembly, and Circuits Technology Conference Taipei, Taiwan, et al. Proceedings of Technical Papers 2007 International Microsystems, Packaging, Assembly, and Circuits Technology Conference : October 1-3, 2007, Taipei International Convention Center, Taipei, Taiwan: 2007 International Microsystems, Packaging, Assembly, and Circuits Technology Conference : October 1-3, 2007, Taipei International Convention Center, Taipei, Taiwan. Industrial Technology Research Institute ; IEEE, 2007.