Collection of papers presented at the 13th International Workshop on THERMal INvestigation of ICs and Systems Budapest, Hungary 17-19 September 2007 / sponsored by CMP, IEEE, CPMT.

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Bibliographic Details
Corporate Authors: International Workshop on Thermal Investigations of ICs and Microstructures Budapest, Hungary, CMP (Firm), Institute of Electrical and Electronics Engineers, Components, Packaging & Manufacturing Technology Society, IEEE Xplore (Online service)
Format: eBook
Language:English
Published: [France?] : EDA Pub., c2007.
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Online Access:Access restricted to subscribers
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