Proceedings, 2008 International Conference on Electronic Packaging Technology & High Density Packaging ICEPT-HDP 2008 : location, Riverfront Business Hotel, Pudong, Shanghai, China : dates, Monday, July 28 to Thursday, July 31, 2008 / directed by China Institute of Electronics ... [et al.] ; sponsored by China Electronics Packaging Society, of China Institute of Electronics, China (CEPS) ... [et al.] ; organized by China Electronics Packaging Society of China Institute of Electronics (CEPS) ... [et al.] ; co-organized by Hong Kong Applied Science & Technology Research Institute (ASTRI) ... [et al.] ; editors, Keyun Bi, Fei Xiao.
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| Corporate Authors: | , |
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| Other Authors: | , |
| Format: | eBook |
| Language: | English |
| Published: |
Piscataway, NJ :
IEEE,
c2008.
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| Subjects: | |
| Online Access: | IEEE Xplore |
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