Library Catalogue Plus

APA (7th ed.) Citation

International Conference on Electronic Packaging Technology & High Density Packaging Shanghai, China, China Electronic Packaging Society, Bi, K., & Xiao, F. (2008). Proceedings, 2008 International Conference on Electronic Packaging Technology & High Density Packaging ICEPT-HDP 2008 : location, Riverfront Business Hotel, Pudong, Shanghai, China : dates, Monday, July 28 to Thursday, July 31, 2008 / directed by China Institute of Electronics ... [et al.] ; sponsored by China Electronics Packaging Society, of China Institute of Electronics, China (CEPS) ... [et al.] ; organized by China Electronics Packaging Society of China Institute of Electronics (CEPS) ... [et al.] ; co-organized by Hong Kong Applied Science & Technology Research Institute (ASTRI) ... [et al.] ; editors, Keyun Bi, Fei Xiao: ICEPT-HDP 2008 : location, Riverfront Business Hotel, Pudong, Shanghai, China : dates, Monday, July 28 to Thursday, July 31, 2008. IEEE.

Chicago Style (17th ed.) Citation

International Conference on Electronic Packaging Technology & High Density Packaging Shanghai, China, China Electronic Packaging Society, Keyun Bi, and Fei Xiao. Proceedings, 2008 International Conference on Electronic Packaging Technology & High Density Packaging ICEPT-HDP 2008 : Location, Riverfront Business Hotel, Pudong, Shanghai, China : Dates, Monday, July 28 to Thursday, July 31, 2008 / Directed by China Institute of Electronics ... [et Al.] ; Sponsored by China Electronics Packaging Society, of China Institute of Electronics, China (CEPS) ... [et Al.] ; Organized by China Electronics Packaging Society of China Institute of Electronics (CEPS) ... [et Al.] ; Co-organized by Hong Kong Applied Science & Technology Research Institute (ASTRI) ... [et Al.] ; Editors, Keyun Bi, Fei Xiao: ICEPT-HDP 2008 : Location, Riverfront Business Hotel, Pudong, Shanghai, China : Dates, Monday, July 28 to Thursday, July 31, 2008. Piscataway, NJ: IEEE, 2008.

MLA (9th ed.) Citation

International Conference on Electronic Packaging Technology & High Density Packaging Shanghai, China, et al. Proceedings, 2008 International Conference on Electronic Packaging Technology & High Density Packaging ICEPT-HDP 2008 : Location, Riverfront Business Hotel, Pudong, Shanghai, China : Dates, Monday, July 28 to Thursday, July 31, 2008 / Directed by China Institute of Electronics ... [et Al.] ; Sponsored by China Electronics Packaging Society, of China Institute of Electronics, China (CEPS) ... [et Al.] ; Organized by China Electronics Packaging Society of China Institute of Electronics (CEPS) ... [et Al.] ; Co-organized by Hong Kong Applied Science & Technology Research Institute (ASTRI) ... [et Al.] ; Editors, Keyun Bi, Fei Xiao: ICEPT-HDP 2008 : Location, Riverfront Business Hotel, Pudong, Shanghai, China : Dates, Monday, July 28 to Thursday, July 31, 2008. IEEE, 2008.