2008 proceedings, 58th Electronic Components and Technology Conference Orlando, Florida USA : May 27 2008-May 30, 2008.

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Bibliographic Details
Corporate Authors: Electronic Components & Technology Conference Orlando, Fla., Components, Packaging & Manufacturing Technology Society, EIA Electronic Components, Assemblies & Materials Association, Institute of Electrical and Electronics Engineers
Format: eBook
Language:English
Published: Piscataway, N.J. : IEEE, c2008.
Subjects:
Electronic apparatus and appliances > Congresses.
Electronic industries > Congresses.
Microelectronics > Congresses.
Electronic packaging > Congresses.
Semiconductors > Congresses.
Online Access:http://www.ieeexplore.ieee.org/servlet/opac?punumber=454256
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