2008 EMAP the 10th International Conference on Electronic Materials and Packaging.
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| Corporate Author: | |
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| Format: | eBook |
| Language: | English |
| Published: |
[Piscataway, N.J.] :
IEEE,
c2008.
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| Subjects: | |
| Online Access: | http://ieeexplore.ieee.org/servlet/opac?punumber=4773271 |
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