IEEE 9th VLSI Packaging Workshop in Japan VPWJ 2008 : December 1st-2nd, 2008, the Westin Miyako Kyoto, Kyoto, Japan / sponsored by the IEEE Components, Packaging, and Manufacturing Technology (CPMT) Society and cooperatively sponsored by the National Institute of Standards and Technology (NIST).

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Bibliographic Details
Corporate Authors: VLSI Packaging Workshop in Japan Kyoto, Japan, Components, Packaging & Manufacturing Technology Society, National Institute of Standards and Technology (U.S.)
Format: eBook
Language:English
Published: Piscataway, NJ : IEEE, c2008.
Subjects:
Electronic packaging > Congresses.
Integrated circuits > Very large scale integration > Congresses.
Online Access:http://ieeexplore.ieee.org/servlet/opac?punumber=4745909
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