Electrical modeling and design for 3D system integration 3D integrated circuits and packaging, signal integrity, power integrity and EMC / Er-Ping Li.
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| Format: | eBook |
| Language: | English |
| Published: |
[United States] : Hoboken :
IEEE Press ; Wiley,
c2012.
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| Online Access: | http://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=6183551 |
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