Silicon wafer bonding technology for VLSI and MEMS applications Subramanian S. Iyer and Andre J. Auberton-Herve (ed.).

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Bibliographic Details
Corporate Author: Institution of Electrical Engineers
Other Authors: Iyer, Subramanian S., Auberton-Herve, Andre J.
Format: eBook
Language:English
Published: Stevenage : IET, 2002.
Series:EMIS processing series 1
Subjects:
Bonding.
Electric resistance.
Integrated circuits > Very large scale integration.
Micromechanics.
Semiconductor wafers.
Silicon.
Silicon-on-insulator technology.
Online Access:http://dx.doi.org/10.1049/PBEP001E
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