Lead free solder : mechanics and reliability / John Hock Lye Pang. mechanics and reliability /

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Bibliographic Details
Main Author: Pang, John Hock Lye
Format: Book
Language:English
Published: New York, NY : Springer, c2012.
Subjects:
Solder and soldering.
Lead-free electronics manufacturing processes.
Green electronics.
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Pilkington Library

Availability details from Pilkington Library
Shelfmark: 621.381/PAN
Copy number Shelving location Availability
Copy [0404672876] Unknown On Shelf

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