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Lead free solder : mechanics a...
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Lead free solder : mechanics and reliability / John Hock Lye Pang.
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Bibliographic Details
Main Author:
Pang, John Hock Lye
Format:
Book
Language:
English
Published:
New York, NY :
Springer,
c2012.
Subjects:
Solder and soldering.
Lead-free electronics manufacturing processes.
Green electronics.
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