MEMS packaging editors, Y C Lee, Yu-Ting Cheng, Ramesh Ramadoss.
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| Other Authors: | , , |
|---|---|
| Format: | eBook |
| Language: | English |
| Published: |
Singapore :
World Scientific Publishing Co. Pte Ltd.,
2018.
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| Series: | WSPC series in advanced integration and packaging ;
vol. 5. |
| Subjects: | |
| Online Access: | http://www.worldscientific.com/worldscibooks/10.1142/10692#t=toc |
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