Advanced materials for thermal management of electronic packaging Xingcun Colin Tong.
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| Main Author: | |
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| Format: | eBook |
| Language: | English |
| Published: |
New York :
Springer,
2011.
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| Series: | Springer series in advanced microelectronics ;
30. |
| Subjects: | |
| Online Access: | https://ebookcentral.proquest.com/lib/lboro/detail.action?docID=667098 |
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