Tong, X. C. (2011). Advanced materials for thermal management of electronic packaging Xingcun Colin Tong. Springer.
Chicago Style (17th ed.) CitationTong, Xingcun Colin. Advanced Materials for Thermal Management of Electronic Packaging Xingcun Colin Tong. New York: Springer, 2011.
MLA (9th ed.) CitationTong, Xingcun Colin. Advanced Materials for Thermal Management of Electronic Packaging Xingcun Colin Tong. Springer, 2011.
Warning: These citations may not always be 100% accurate.