Electrical conduction stability of copper-filled adhesives in high-moisture environments

Isotropic Conductive Adhesives (ICAs) are widely used as a substitute for solders and as conductive inks in order to create circuit patterns for printed electronics (such as sensors) and electrical interconnects to components, because their processing is low temperature and compatible with a range o...

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Bibliographic Details
Main Author: Shanda Wang
Format: Default Thesis
Published: 2020
Subjects:
Mechanical engineering not elsewhere classified
Self-Assembled Monolayer
Isotropic Conductive Adhesives
Conduction Mechanism
Failure Mechanism
Electrical Interconnection
Reliability Test
Stability Test
High Moisture
Copper
Epoxy
X-ray Photoelectron Spectroscopy
Scanning Electron Microscopy
Transmission Electron Microscopy
Mechanical Engineering not elsewhere classified
Online Access:https://dx.doi.org/10.26174/thesis.lboro.13020575.v1
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