Areal surface texture parameters for copper/glass plating adhesion characteristics
Glass as an alternative printed circuit board material and interposer has been investigated for use in the micro-electronics industry. Electroless copper plating is used to provide the conductive layer, but there is limited understanding of how the surface topography of the glass substrate affects t...
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| Main Authors: | , , |
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| Format: | Default Article |
| Published: |
2021
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| Subjects: | |
| Online Access: | https://hdl.handle.net/2134/14515422.v1 |
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