Advanced Pb-free interconnect materials and manufacture processes to enable high-temperature electronics packaging

The past decade has witnessed the rapid development of wide-bandgap (WBG) semiconductors (e.g. GaN and SiC). These devices can operate under harsher environments compared to traditional Si semiconductors, presently being exploited in the integrations into wider range power systems in electric vehicl...

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Bibliographic Details

Main Author:	Canyu Liu
Format:	Default Thesis
Published:	2022
Subjects:	Electrical engineering not elsewhere classified Manufacturing engineering not elsewhere classified Mechanical engineering not elsewhere classified high-temperature electronics packaging nano-Ag Self-assembled monolayers Zn-5Al ultrasonic vibration Cu-15Ag-5P Incusil brazing alloy Self-propagating exothermic reaction
Online Access:	https://dx.doi.org/10.26174/thesis.lboro.21397191.v1
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