Advanced electronic interconnections based on template-assisted electrodeposited Cu nanowire/micropillar arrays

With the rapid development of electronics towards miniaturization and increased functionality, the heterogeneous integration of electronic components necessities a paradigm shift in the design of physical dispositions and selection of materials, as the conventional joining approach is becoming incre...

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Bibliographic Details

Main Author:	Han Jiang
Format:	Default Thesis
Published:	2022
Subjects:	Electrical engineering not elsewhere classified Manufacturing engineering not elsewhere classified Mechanical engineering not elsewhere classified Electronic packaging Interconnection Template-assisted electrodeposition Cu nanowire array Cu-Sn nanocomposite interlayer Cu micropillar array Transient liquid phase bonding Self-propagating exothermic reaction Intermetallic compounds Microstructure Mechanical property
Online Access:	https://dx.doi.org/10.26174/thesis.lboro.21564786.v1
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