Fast in-situ synchrotron X-ray imaging of the interfacial reaction during self-propagating exothermic reactive bonding

Self-Propagating Exothermic Reactive (SPER) bonding with lead-free solders is potentially attractive for microelectronics assembly due to its highly localised heating and minimal thermal loading of the components and substrates. The transient dynamics of melting, wetting, solidification and defect f...

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Bibliographic Details

Main Authors:	S Ramachandran, Yi Zhong, Stuart Robertson, Christoforos Panteli, Shuibao Liang, Fan Wu, Renqian Zhou, Shashidhara Marathe, Zhaoxia Zhou, Andrew S Holmes, Sarah J Haigh, Changqing Liu, Wajira Mirihanage
Format:	Default Article
Published:	2022
Subjects:	Self-propagating exothermic reactive (SPER) bonding Synchrotron in-situ imaging Wetting Void formation Quasi ambient bonding (QAB)
Online Access:	https://hdl.handle.net/2134/22182907.v1
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