Mechanical property of intermetallic compounds in Zn–Al solder interconnects by nanoindentation and first-principles calculations

Presently, interfacial intermetallic compounds play a vital role in determining the reliability of solder joints due to their intrinsic mechanical property. Especially for Zn–Al solder joints, the interfacial Cu–Zn IMCs grow significantly without diffusion barriers. This work comprehensively investi...

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Bibliographic Details
Main Authors: Li Liu, Chenru Zhang, Song Du, Zhiwen Chen, Simin Li, Ziwen Chen, Qian Wang, Lingzhu Xie, Changqing Liu
Format: Default Article
Published: 2024
Subjects:
Physical chemistry
Materials engineering
Mechanical engineering
Resources engineering and extractive metallurgy
Materials
Nanoindentation
Intermetallic compounds
Mechanical property
First-principles calculations
Online Access:https://hdl.handle.net/2134/26097271.v1
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