Self-propagating exothermic reactive bonding with Cu–Sn nanocomposite interlayer for electronic interconnects

Stacking multiple components is a crucial technique for integrating power electronics, achieved through reliable bonding techniques. Self-propagating exothermic reactive (SPER) bonding has become attractive for microelectronic interconnections, due to its minimal heat excursion and interventions to...

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Bibliographic Details
Main Authors: Han Jiang, Changqing Liu, Shuibao Liang, Zhaoxia Zhou, Liguo Zhao
Format: Default Article
Published: 2025
Subjects:
Engineering
Electronics, sensors and digital hardware
Applied physics
Components stacking
Interconnects
Reliability
Self-propagating exothermic reaction
Bonding
Heating systems
Substrates
Sintering
Scanning electron microscopy
Plating
Microstructure
Integrated circuit interconnections
Hemorrhaging
Transient analysis
Online Access:https://hdl.handle.net/2134/29618705.v1
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