Thin film properties by blister tests

With the measured geometry morphologies of telephone cord blisters (TCBs), that is, the local blister width and height, and the global wavelength, a mechanical model is built to determine the residual compressive stress in thin films and interface adhesion toughness. This model is based on the hypot...

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Bibliographic Details

Main Authors:	Simon Wang, Christopher Harvey, Bo Yuan, Gary Critchlow, Rachel Thomson
Format:	Default Conference proceeding
Published:	2018
Subjects:	Materials engineering not elsewhere classified Telephone cord blisters Pockets of energy concentration Residual stress Interface adhesion toughness Spallation Materials Engineering not elsewhere classified
Online Access:	https://hdl.handle.net/2134/33596
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