Determination of mode I and II adhesion toughness of monolayer thin films by circular blister tests

Mechanical models are developed to determine the mode I and II adhesion toughness of monolayer thin films using circular blister tests under either pressure load or point load. The interface fracture of monolayer thin film blisters is mode I dominant for linear bending with small deflection while it...

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Bibliographic Details

Main Authors:	Christopher Harvey, Simon Wang, Bo Yuan, Rachel Thomson, Gary Critchlow
Format:	Default Article
Published:	2018
Subjects:	Materials engineering not elsewhere classified Mechanical engineering not elsewhere classified Adhesion toughness Circular blisters Energy release rate Interface fracture Thin films Materials Engineering not elsewhere classified Mechanical Engineering
Online Access:	https://hdl.handle.net/2134/28040
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