Determination of residual stress and interface adhesion toughness of thin films by blisters

Circular blisters and telephone cord blisters (TCBs) can spontaneously occur in thin films under constant bi-axial compressive residual stress. In this work, new mechanical models are used in conjunction with measurements of blister morphology parameters to determine the residual stress in films and...

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Bibliographic Details
Main Authors: Bo Yuan, Christopher Harvey, Gary W. Critchlow, Rachel Thomson, Simon Wang
Format: Default Article
Published: 2019
Subjects:
Other engineering not elsewhere classified
Thin film
Residual stress
Fracture toughness
Spalling fracture
Adhesion strength
Engineering not elsewhere classified
Online Access:https://hdl.handle.net/2134/37384
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