The electrodeposition of tin coatings from deep eutectic solvents and their subsequent whisker growth

Tin electrodeposits produced from aqueous electrolytes are frequently used within the electronics industry due to their high solderability and corrosion protection. One limitation to using these deposits is their spontaneous formation of long conductive filament whiskers. These whiskers grow post-el...

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Bibliographic Details
Main Author: Christopher Stuttle
Format: Default Thesis
Published: 2014
Subjects:
Materials engineering not elsewhere classified
Tin electrodeposition
Ionic liquids
Deep eutectic solvents
Tin whiskers
Intermetallic compound
Materials Engineering not elsewhere classified
Online Access:https://hdl.handle.net/2134/17961
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