Enhanced copper electrodeposition onto printed circuit boards using pulsed current and eductor agitation

Printed Circuit Board (PCB) manufacture involves an electrolytic copper deposition stage for consolidation of conductive circuit paths. Miniaturisation trends requiring increased circuit densities and high aspect ratio through-holes are restricted by the phenomenon of non-uniform copper electrodepos...

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Bibliographic Details
Main Author: Matthew Ward
Format: Default Thesis
Published: 1999
Subjects:
Materials engineering not elsewhere classified
Electrodeposition
Copper
Eductor agitation
Materials Engineering not elsewhere classified
Online Access:https://hdl.handle.net/2134/7476
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