Electrodeposition and characterisation of nickel-niobium-based diffusion barrier metallisations for high temperature electronics interconnections

The control of interfacial microstructural stability is of utmost importance to the reliability of liquid solder interconnects in high temperature electronic assemblies. This is primarily due to excessive intermetallic compounds (IMCs) that can form and continuously grow during high temperature oper...

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Bibliographic Details
Main Author: Jing Wang
Format: Default Thesis
Published: 2016
Subjects:
Materials engineering not elsewhere classified
Electrodeposition
Liquid solders
In-Sn
Diffusion barrier metallisations
Ni-NbOx
Composites
Deep eutectic solvents
Type IV Deep Eutectic Solvents
STEM
XPS
EQCM
GCIB
Materials Engineering not elsewhere classified
Online Access:https://hdl.handle.net/2134/20590
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https://hdl.handle.net/2134/20590

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