Interfacial reaction and microstructural evolution between Au-Ge solder and electroless Ni-W-P metallization in high temperature electronics interconnects

© 2017 IEEE. The elevated working temperature of high temperature electronics can inevitably cause potential excessive growth of interfacial intermetallic compounds (IMCs), which can significantly deteriorate the mechanical integrity of electronic devices. Therefore, a robust diffusion barrier that...

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Bibliographic Details

Main Authors:	Li Liu, Jinzi Cui, Jing Wang, Zhaoxia Zhou, R. Wayne Johnson, Changqing Liu
Format:	Default Conference proceeding
Published:	2017
Subjects:	Mechanical engineering not elsewhere classified untagged Mechanical Engineering not elsewhere classified
Online Access:	https://hdl.handle.net/2134/36626
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