Thermal stability of high temperature Pb-free solder interconnect characterised by in-situ electron microscopy

The present investigation aimed to use in-situ heating experiment in a transmission electron microscope (TEM) to live characterize the thermal stability of a Cu/Ni-W-P interlayer/ZnAl solder interconnect. It demonstrated the TEM was able to detect live intermetallic compounds (IMCs) growth during he...

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Bibliographic Details
Main Authors: Zhaoxia Zhou, Li Liu, Changqing Liu
Format: Default Conference proceeding
Published: 2018
Subjects:
Mechanical engineering not elsewhere classified
Thermal stability
High temperature Pb-free solder
Zn-Al solder
Interconnect
In-situ electron microscopy
Mechanical Engineering not elsewhere classified
Online Access:https://hdl.handle.net/2134/36948
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