The effect of electroplating parameters and substrate material on tin whisker formation

Electroplated tin finishes are widely used in the electronics industry due to their excellent solderability, electrical conductivity and corrosion resistance. However, the spontaneous growth of tin whiskers during service can result in localised electrical shorting or other harmful effects. Until re...

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Bibliographic Details
Main Authors: Mark Ashworth, Geoffrey Wilcox, Rebecca Higginson, Richard Heath, Changqing Liu, Roger J. Mortimer
Format: Default Article
Published: 2014
Subjects:
Materials engineering not elsewhere classified
Tin Whisker growth
Electrodeposition
Intermetallic formation
Characterisation
Materials Engineering not elsewhere classified
Online Access:https://hdl.handle.net/2134/16616
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https://hdl.handle.net/2134/16616

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