Copper-based graphene nanoplatelet composites as interconnect for power electronics pacakging

© 2018 IEEE. The present investigation demonstrates a singlestep electrodeposition route for the fabrication of compact copper-based graphene nanoplatelets (GnPs) nanocomposite coatings, with dispersed GnP co-deposition. The effect of cathodic current density on the surface morphology of the deposit...

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Bibliographic Details
Main Authors: Jing Wang, Zhaoxia Zhou, Wen-Feng Lin, Changqing Liu, Behzad Ahmadi, Lee Empringham
Format: Default Conference proceeding
Published: 2018
Subjects:
Mechanical engineering not elsewhere classified
Power electronic systems packaging
Heterogeneous integration
Composite electrodeposition
Cu electroplating
Mechanical Engineering not elsewhere classified
Online Access:https://hdl.handle.net/2134/38261
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