Novel fine pitch interconnection methods using metallised polymer spheres

There is an ongoing demand for electronics devices with more functionality while reducing size and cost, for example smart phones and tablet personal computers. This requirement has led to significantly higher integrated circuit input/output densities and therefore the need for off-chip interconnect...

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Bibliographic Details

Main Author:	Junlei Tao
Format:	Default Thesis
Published:	2016
Subjects:	Other built environment and design not elsewhere classified untagged Built Environment and Design not elsewhere classified
Online Access:	https://hdl.handle.net/2134/22372
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