Electroless metallisation of glass for electrical interconnect applications

The microelectronics industry requires continuous advances due to ever-evolving technology and the corresponding need for higher density substrates with smaller features. Specifically, new dielectric materials with enhanced electrical properties are needed. At the same time, adhesion must be maintai...

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Bibliographic Details

Main Author:	Xiaoyun Cui
Format:	Default Thesis
Published:	2009
Subjects:	Mechanical engineering not elsewhere classified Glass substrate Electroless copper deposition Electroless nickel deposition Thin film adhesion Micro-mechanical properties Scratch test Laser machining Mechanical Engineering not elsewhere classified
Online Access:	https://hdl.handle.net/2134/10303
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