Microstructural and mechanical characteristics of micro-scale intermetallic compounds interconnections

Following the continually increasing demand for high-density interconnection and multilayer packaging for chips, solder bump size has decreased significantly over the years, this has led to some challenges in the reliability of interconnects. This thesis presents research into the resulting effects...

Full description

Saved in:
Bibliographic Details
Main Author: Liping Mo
Format: Default Thesis
Published: 2016
Subjects:
Mechanical engineering not elsewhere classified
Intermetallics
Microstructure
Phase transformation
Electron backscatter diffraction (EBSD)
In-situ micro-mechanical test
Mechanical Engineering not elsewhere classified
Online Access:https://hdl.handle.net/2134/23258
Tags: Add Tag
No Tags, Be the first to tag this record!

Similar Items