Micro-mechanical characteristics and dimensional change of Cu-Sn interconnects due to growth of interfacial intermetallic compounds

Sn-based solder alloys are extensively used in electronic devices to form interconnects between different components to provide mechanical support and electrical path. The formation of a reliable solder interconnects fundamentally relies on the metallurgic reaction between the molten solder and soli...

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Bibliographic Details

Main Author:	Zhiwen Chen
Format:	Default Thesis
Published:	2015
Subjects:	Mechanical engineering not elsewhere classified Growth of IMCs Micro cantilever bending Collapse of solder joint Residual stress Nanoindentation Finite element modelling. Mechanical Engineering not elsewhere classified
Online Access:	https://hdl.handle.net/2134/18431
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