An investigation into nano-particulates reinforced SAC305-based composite solders under electro- and thermo-migration conditions

With the rapid development in electronic packaging due to product miniaturisation, the size of solder joints is decreasing considerably, thus the failure of solder interconnects induced by electro-migration (EM) and thermo-migration (TM) became a reliability concern. The incorporation of foreign rei...

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Bibliographic Details
Main Author: Guang Chen
Format: Default Thesis
Published: 2017
Subjects:
Mechanical engineering not elsewhere classified
Composite solders
Isothermal ageing
Electro-migration (EM)
Thermo-migration (TM)
Microstructural evolution
Mechanical properties
Mechanical Engineering not elsewhere classified
Online Access:https://hdl.handle.net/2134/27576
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