Microstructural features and mechanical behaviour of lead free solders for microelectronic packaging

The demands for high density, fine pitch interconnections in electronics systems has seen solder-based approaches for such interconnections miniaturized to the scale of tens of micro meters. At such a small scale, such 'micro joints' may contain only one or a few grains and the resultant m...

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Bibliographic Details

Main Author:	Jicheng Gong
Format:	Default Thesis
Published:	2007
Subjects:	Mechanical engineering not elsewhere classified Ph-free solder Interface Intermetallic compounds Dendrites Eutectics Micro-mechanical testing Inter- and intra- granular behaviour Crystal plasticity Finite element Mechanical Engineering not elsewhere classified
Online Access:	https://hdl.handle.net/2134/15102
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