Transient thermography for detection of micro-defects in multilayer thin films

Delamination and cracks within the multilayer structure are typical failure modes observed in microelectronic and micro electro mechanical system (MEMS) devices and packages. As destructive detection methods consume large numbers of devices during reliability tests, non-destructive techniques (NDT)...

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Bibliographic Details
Main Author: Xiaoting Wang
Format: Default Thesis
Published: 2017
Subjects:
Mechanical engineering not elsewhere classified
Micro-electronic-mechanical system (MEMS)
Transient infrared thermography
Non-destructive technique (NDT)
Delamination
Mechanical Engineering not elsewhere classified
Online Access:https://hdl.handle.net/2134/25174
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https://hdl.handle.net/2134/25174

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