A novel chip-to-chip radiative interconnection technique for gigabit logic multi-chip modules using leaky wave antennas

Multi-Chip Modules (MCMs) are considered as the next major step in the evolution of high performance microelectronic packaging. Advances in the performance of very high speed MCMs are limited by problems associated with interconnecting devices using metallic interconnects within the module. The need...

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Bibliographic Details

Main Author:	Mahadevan K. Iyer
Format:	Default Thesis
Published:	1994
Subjects:	Mechanical engineering not elsewhere classified untagged Mechanical Engineering not elsewhere classified
Online Access:	https://hdl.handle.net/2134/27246
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