Finite element modelling of the thermal effects of the manufacturing process on the quality of electronics interconnection
This thesis demonstrates the feasibility of using finite element analysis to model the thenno-mechanica1 effects of manufacturing processes on electronics interconnection. The thesis has two significant complementary parts. The first of these explores the modelling of heat transfer in a commercial s...
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| Format: | Default Thesis |
| Published: |
1994
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| Subjects: | |
| Online Access: | https://hdl.handle.net/2134/11043 |
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