Electrodeposition and characterisation of lead-free solder alloys for electronics interconnection

Conventional tin-lead solder alloys have been widely used in electronics interconnection owing to their properties such as low melting temperature, good ductility and excellent wettability on copper and other substrates. However, due to the worldwide legislation addressing the concern over the toxic...

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Bibliographic Details

Main Author:	Yi Qin
Format:	Default Thesis
Published:	2010
Subjects:	Mechanical engineering not elsewhere classified Lead-free solder alloys Electrodeposition Wafer level solder bumping Flip chip interconnection Mechanical Engineering not elsewhere classified
Online Access:	https://hdl.handle.net/2134/7788
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