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Glass multilayer bonding for high density interconnect substrates
The aim of this research was the investigation of bonding borosilicate glass sheets, its trade mark CMZ, 100μm thickness, to create multilayer substrates capable of supporting high-density electrical interconnections. CMZ glass was chosen as it has a coefficient of thermal expansion that is close to...
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| Format: | Default Thesis |
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2010
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| Online Access: | https://hdl.handle.net/2134/6463 |
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