Simulation and characterisation of electroplated micro-copper columns for electronic interconnection

Growth mechanism of electroplated copper columns has been systematically studied by simulations and characterizations. A two-dimensional cross-sectional kinetic Monte Carlo (2DCS-KMC) model has been developed to simulate the electrodeposition of single crystal copper. The evolution of the microstruc...

Full description

Saved in:
Bibliographic Details
Main Author: Jun Liu
Format: Default Thesis
Published: 2010
Subjects:
Mechanical engineering not elsewhere classified
Electrodeposition
Electroplating
Kinetic Monte Carlo simulation
Copper column
Electrocrystallization
Nucleation
Growth history
Self-annealing
Mechanical Engineering not elsewhere classified
Online Access:https://hdl.handle.net/2134/6103
Tags: Add Tag
No Tags, Be the first to tag this record!

Similar Items