Deposition and application of electroless Ni–W–P under bump metallisation for high temperature lead-free solder interconnects

A reliable and robust diffusion barrier, commonly known as under bump metallisation (UBM), is indispensable in solder interconnects in order to retard the interfacial reaction rate, hence the growth of intermetallic compounds (IMCs). However, electroless Ni-P coatings are not adequate to inhibit int...

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Bibliographic Details
Main Author: Li Liu
Format: Default Thesis
Published: 2016
Subjects:
Mechanical engineering not elsewhere classified
Electroless Ni-W-P deposition
Crystallisation characteristics
Lead-free high temperature solders
Diffusion barrier characteristics
Power electronics
Interfacial reactions
IMCs
Mechanical Engineering not elsewhere classified
Online Access:https://hdl.handle.net/2134/23260
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https://hdl.handle.net/2134/23260

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