Numerical analysis of lead-free solder joints: effects of thermal cycling and electromigration

To meet the requirements of miniaturization and multifunction in microelectronics, understanding of their reliability and performance has become an important research subject in order to characterise electronics served under various loadings. Along with the demands of the increasing miniaturization...

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Bibliographic Details
Main Author: Xu Zha
Format: Default Thesis
Published: 2016
Subjects:
Mechanical engineering not elsewhere classified
Lead-free solder joint
Micro scale
Finite element
Thermal fatigue
Electro-migration
Void formation
Joint effect
Mechanical Engineering not elsewhere classified
Online Access:https://hdl.handle.net/2134/23446
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