Soldering interconnects through self-propagating reaction process

This thesis presents a research into the solder interconnects made through the reactive bonding process based on the self-propagating reaction. A numerical study of soldering conditions in the heat affected zone (HAZ) during bonding was initially carried out in order to understand the self-propagati...

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Bibliographic Details
Main Author: Wenbo Zhu
Format: Default Thesis
Published: 2016
Subjects:
Mechanical engineering not elsewhere classified
Self-propagating reaction
Reactive bonding
Soldering condition
Non-equilibrium soldering
Interfacial reaction
Cross-sectional microstructure
Reliability
Mechanical integrity
Influencing factors
High-temperature aging
Mechanical Engineering not elsewhere classified
Online Access:https://hdl.handle.net/2134/23259
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