Thermosonic ball bonding: a study of bonding mechanism and interfacial evolution

Thermosonic ball bonding is a key technology in electrical interconnections between an integrated circuit and an external circuitry in microelectronics. Although this bonding process has been extensively utilised in electronics packaging industry, certain fundamental aspects behind all the practice...

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Bibliographic Details

Main Author:	Hui Xu
Format:	Default Thesis
Published:	2010
Subjects:	Mechanical engineering not elsewhere classified Thermosonic ball bonding, Bonding mechanism, Interfacial evolution, Alumina, Intermetallic compound, Bonding strength, Mechanical Engineering not elsewhere classified
Online Access:	https://hdl.handle.net/2134/6325
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