Materials issues in the transition to lead-free solder alloys and joint miniaturization

Within the context of the imminent implementation of the Pb-free soldering in Europe in 2006, this thesis addresses the gap in understanding that has emerged in the fundamental materials issues between well-understood and mature lead-containing solders and a plethora of new, Pb-free solders for whic...

Full description

Bibliographic Details

Main Author:	Zhiheng Huang
Format:	Default Thesis
Published:	2005
Subjects:	Mechanical engineering not elsewhere classified Solders Intermetallic compounds Thermodynamic and kinetic modelling Solder joint size and geometry Microstructure Mechanical properties Mechanical Engineering not elsewhere classified
Online Access:	https://hdl.handle.net/2134/25232
Tags:	Add Tag No Tags, Be the first to tag this record!