A study on indium joints for low-temperature microelectronics interconnections

For microelectronics used in the low-temperature applications, the understanding of their reliability and performance has become an important research subject characterised as electronics to serve under the severe or extreme service conditions. Along with the impact from the increased miniaturizatio...

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Bibliographic Details
Main Author: Xiaojin Cheng
Format: Default Thesis
Published: 2011
Subjects:
Mechanical engineering not elsewhere classified
Indium joint
Intermetallics
Joint size
Substrate type
Low temperatures
Stress-strain properties
Creep
Finite element
Mechanical Engineering not elsewhere classified
Online Access:https://hdl.handle.net/2134/9093
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Internet

https://hdl.handle.net/2134/9093

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